No of Layer: 8
Material: FR-4, Shengyi, TG170
Board thickness: 1.6mm
Copper weight: 35um (1oz)
Surface Finishing: Immersion gold, Gold 0.05-0.1um, Nickle 3-5um
Special technonolgy: BGA, Impdance control, 3mil/3mil lines
Application: semi-conductors, FPGA, Embedded electronics, Medical, consumer electronics, etc
