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  • Hybrid multilayer PCB
    Hybrid multilayer PCB
    No of Layer: 4
    Material: FR-4, TG170 + Rogers RO4003C
    Board thickness: 1.6mm
    Copper weight: 35/18/18/35um
    Surface finishing: Immersion gold
    Solder mask color: green
    Other requirement: impedance control, via-in-PAD
    Application: Telecommunication, Satellite, RF, Aerospace, Medica, Antenna...
  • Via In Pad PCB
    Via In Pad PCB
    No of Layer: 4, 6 or more
    Material: FR-4, TG170, KB/Shengyi
    Board thickness: 1.6mm
    Copper weight: 35um=1oz
    Surface finishing: ENIG=Immersion Gold
    Solder mask: Glossy Blue
    Silk screen: White
    Key technology: Via In Pad
  • 6 Layer impedance control PCB
    6 Layer impedance control PCB
    No of Layer: 6
    Material: FR-4, TG170
    Board thickness: 1.7mm
    Copper weight: 2/2/2/2/2/2 oz
    Surface finishing: ENIG=Immersion Gold
    Solder mask: Glossy Green
    Other technology: BGA, Single-line impedance, Differtial-line impedance, via-in-PAD
    Application: Industrial automation, Security system, Computer hardware, etc
  • 4 Layer Castellated Hole PCB
    4 Layer Castellated Hole PCB
    No of Layer: 4 Layer
    Material: FR-4, Shengyi
    Board thickness: 1.6mm
    Copper thickness: 1oz=35um
    Surface finishing: ENIG, Gold 0.05-0.1um, Nickel 3-5um
    Key Technology: Castellated Hole, Half Hole Plated
    Application: consumer electronics, embedded, electronics, wireless, RFID
  • 4 Layer PCB
    4 Layer PCB
    Material: FR-4, TG170, Shengyi
    Board thickness: 1.5mm
    Copper thickness: 2/1/1/2 oz
    Surface treatment: ENIG=Immersion Gold
    Application: consumer electronics, embedded, security, power supply, wireless
  • 6 Layer Smart Phone PCB
    6 layer PCB for Smart phone
    No of Layer: 6
    Material: FR-4, Shengyi
    Board thickness: 1.2mm
    Copper thickness: 2oz/70um
    Surface Finishing: ENIG, thick gold
    Line width/space: 0.075mm/3mil
    BGA, Blind via
    Application: Cell phone, Smart phone, Mobile phone, etc
  • 8 Layer printed circuit board
    No of Layer: 8
    Material: FR-4, Shengyi, TG170
    Board thickness: 1.6mm
    Copper weight: 35um (1oz)
    Surface Finishing: Immersion gold, Gold 0.05-0.1um, Nickle 3-5um
    Solder mask: Matt Green
    Special technonolgy: BGA, Impdance control, 3mil/3mil lines
    Application: semi-conductors, FPGA, Embedded electronics, Medical, consumer electronics, etc
  • 6 Layer PCB
    No of layer: 6 layers
    Material: FR-4 KB, ShengYi
    Board thickness: 1.5mm
    Copper thickness: 70um/20z
    Surface finishing: ENIG, gold 0.05-0.1um, nickel 3-6um
    Min line width: 0.1mm/4mil
    Min line space: 0.1mm/4mil
    Application: LED screen, medical equipment, Industrial automation, embedded
  • Impedance Control PCB
    No of Layer: 8
    Material: FR-4, Shengyi, TG170
    Board thickness: 1.6mm
    Copper weight: 35um (1oz)
    Surface Finishing: Immersion gold, Gold 0.05-0.1um, Nickle 3-5um
    Special technonolgy: BGA, Impdance control, 3mil/3mil lines
    Application: semi-conductors, FPGA, Embedded electronics, Medical, consumer electronics, etc
Total 9 1 records Current page / Total 1 20 per page
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