Hybrid multilayer PCB
No of Layer: 4
Material: FR-4, TG170 + Rogers RO4003C
Board thickness: 1.6mm
Copper weight: 35/18/18/35um
Surface finishing: Immersion gold
Solder mask color: green
Other requirement: impedance control, via-in-PAD
Application: Telecommunication, Satellite, RF, Aerospace, Medica, Antenna...

Via In Pad PCB
No of Layer: 4, 6 or more
Material: FR-4, TG170, KB/Shengyi
Board thickness: 1.6mm
Copper weight: 35um=1oz
Surface finishing: ENIG=Immersion Gold
Solder mask: Glossy Blue
Silk screen: White
Key technology: Via In Pad

6 Layer impedance control PCB
No of Layer: 6
Material: FR-4, TG170
Board thickness: 1.7mm
Copper weight: 2/2/2/2/2/2 oz
Surface finishing: ENIG=Immersion Gold
Solder mask: Glossy Green
Other technology: BGA, Single-line impedance, Differtial-line impedance, via-in-PAD
Application: Industrial automation, Security system, Computer hardware, etc

4 Layer Castellated Hole PCB
No of Layer: 4 Layer
Material: FR-4, Shengyi
Board thickness: 1.6mm
Copper thickness: 1oz=35um
Surface finishing: ENIG, Gold 0.05-0.1um, Nickel 3-5um
Key Technology: Castellated Hole, Half Hole Plated
Application: consumer electronics, embedded, electronics, wireless, RFID

4 Layer PCB
Material: FR-4, TG170, Shengyi
Board thickness: 1.5mm
Copper thickness: 2/1/1/2 oz
Surface treatment: ENIG=Immersion Gold
Application: consumer electronics, embedded, security, power supply, wireless

6 layer PCB for Smart phone
No of Layer: 6
Material: FR-4, Shengyi
Board thickness: 1.2mm
Copper thickness: 2oz/70um
Surface Finishing: ENIG, thick gold
Line width/space: 0.075mm/3mil
BGA, Blind via
Application: Cell phone, Smart phone, Mobile phone, etc

No of Layer: 8
Material: FR-4, Shengyi, TG170
Board thickness: 1.6mm
Copper weight: 35um (1oz)
Surface Finishing: Immersion gold, Gold 0.05-0.1um, Nickle 3-5um
Solder mask: Matt Green
Special technonolgy: BGA, Impdance control, 3mil/3mil lines
Application: semi-conductors, FPGA, Embedded electronics, Medical, consumer electronics, etc

No of layer: 6 layers
Material: FR-4 KB, ShengYi
Board thickness: 1.5mm
Copper thickness: 70um/20z
Surface finishing: ENIG, gold 0.05-0.1um, nickel 3-6um
Min line width: 0.1mm/4mil
Min line space: 0.1mm/4mil
Application: LED screen, medical equipment, Industrial automation, embedded

No of Layer: 8
Material: FR-4, Shengyi, TG170
Board thickness: 1.6mm
Copper weight: 35um (1oz)
Surface Finishing: Immersion gold, Gold 0.05-0.1um, Nickle 3-5um
Special technonolgy: BGA, Impdance control, 3mil/3mil lines
Application: semi-conductors, FPGA, Embedded electronics, Medical, consumer electronics, etc