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8 Layer blind-buried-via PCB

8 Layer blind-buried-via PCB

Product number:JPS-513
Description

8 Layer blind-buried-via PCB

No of Layer: 8

Material: FR-4, TG170, Shengyi

Board thickness: 1.3mm

Copper thickness: 17um=0.5oz

Surface treatment: ENIG, Nickel 3-5um, Gold 0.05-0.1um

Key technology: BGA, Blind via, Buried via, Via-in-PAD, Micro-via, Impedance Control

Application:  Telecommunications,  Medical, Aerospace,  Motherboard, Wireless

 

                      

 

 


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