8 Layer Blind-Buried-via PCB
No of Layer: 8
Material: FR-4, TG170, Shengyi
Board thickness: 1.3mm
Copper thickness: 17um=0.5oz
Surface treatment: ENIG, Nickel 3-5um, Gold 0.05-0.1um
Key technology: BGA, Blind via, Buried via, Via-in-PAD, Micro-via, Impedance Control
Application: Telecommunications, Medical, Aerospace, Motherboard, Wireless
