8 Layer Blind-Buried-Via PCB

No of Layer: 8
Material: FR-4, TG170, Shengyi
Board thickness: 1.3mm
Copper thickness: 17um=0.5oz
Surface treatment: ENIG, Nickel 3-5um, Gold 0.05-0.1um
Key technology: BGA, Blind via, Buried via, Via-in-PAD, Micro-via, Impedance Control
Application: Telecommunications, Medical, Aerospace, Motherboard, Wireless

Porduct name: 10 Layer PCB
Material: FR-4, Shengyi, Nanya
Thicknss: 2.0mm
Copper thickness: 35um/1oz
Surface: ENIG finishing, Gold 0.05-0.1um, Nickel 3-5um
Solder mask: Green Taiyo
Silk screen: White
Other requirement: Impedance control, Blind Via, Buried Via, Via-in-PAD
Application: Camera, HDMI, Embedded, FPGA, Digital, Medical instrument, etc

Material: FR-4, TG175
Thicknss: 1.6mm
Surface: ENIG finishing, Gold 0.05-0.1um, Nickel 3-5um
Solder mask: Green
Silk screen: White
Other requirement: Impedance control, BGA, Micro via
Application: Camera, HDMI, Embedded, FPGA, Digital, DSP, Sensing

Product description:
Blind vias, L1-L2, L7-L8
Buried vias, L2-L7
BGA work
line width/space: 3mil/3mil
ENIG finishing, 0.05-0.1um gold, 3-5um Nickel
APPLICATION: Medical, Aerospace, Telecommunications, Robotics

8 layer PCB
FR-4, TG170
1.8mm board thickness
1oz copper
ENIG, gold 0.05-0.1um, nickle 3-5um
green solder mask
single line impedance+differential impedance
BGA technology
3mil/3mil line space/width
Application: Medical equipment, industrial automation