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  • 8 Layer Blind-Buried-Via PCB
    8 Layer Blind-Buried-Via PCB

    No of Layer: 8
    Material: FR-4, TG170, Shengyi
    Board thickness: 1.3mm
    Copper thickness: 17um=0.5oz
    Surface treatment: ENIG, Nickel 3-5um, Gold 0.05-0.1um
    Key technology: BGA, Blind via, Buried via, Via-in-PAD, Micro-via, Impedance Control
    Application: Telecommunications, Medical, Aerospace, Motherboard, Wireless
  • 10 Layer PCB Board
    Porduct name: 10 Layer PCB
    Material: FR-4, Shengyi, Nanya
    Thicknss: 2.0mm
    Copper thickness: 35um/1oz
    Surface: ENIG finishing, Gold 0.05-0.1um, Nickel 3-5um
    Solder mask: Green Taiyo
    Silk screen: White
    Other requirement: Impedance control, Blind Via, Buried Via, Via-in-PAD
    Application: Camera, HDMI, Embedded, FPGA, Digital, Medical instrument, etc
  • 10-LAYER-HDI-PCB
    Material: FR-4, TG175
    Thicknss: 1.6mm
    Surface: ENIG finishing, Gold 0.05-0.1um, Nickel 3-5um
    Solder mask: Green
    Silk screen: White
    Other requirement: Impedance control, BGA, Micro via
    Application: Camera, HDMI, Embedded, FPGA, Digital, DSP, Sensing
  • Blind Buried Via PCB
    Product description:
    Blind vias, L1-L2, L7-L8
    Buried vias, L2-L7
    BGA work
    line width/space: 3mil/3mil
    ENIG finishing, 0.05-0.1um gold, 3-5um Nickel
    APPLICATION: Medical, Aerospace, Telecommunications, Robotics
  • 8 Layer HDI PCB
    8 layer PCB
    FR-4, TG170
    1.8mm board thickness
    1oz copper
    ENIG, gold 0.05-0.1um, nickle 3-5um
    green solder mask
    single line impedance+differential impedance
    BGA technology
    3mil/3mil line space/width
    Application: Medical equipment, industrial automation
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