Rigid Flex Circuits with BGA
Material: FR-4(TG170)+Polyimide
No of layer: 4 Layer
Board thickness: 1.0mm
Copper thickness: 35um/1oz
Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
Solder mask: Green
Other technology: BGA
Application: wearables, embedded, consumer electronics, drones, etc
Layer Stackup:
L1: Rigid FR-4
L2: Flex Polyimide
L3: Flex Polyimide
L4: Rigid FR-4
Rigid-Flex PCB Advantages:
1. Dynamism: Flexible circuits give you unlimited freedom of packaging geometry while retaining the precision density and repeatability of printed circuits.
2. Mechanical Stability: The interchanging layers of circuits form a strong foundation. The rigid boards provide stability, while flexible boards provide the flexibility required for installation in small spaces.
3. Space and Money Savings: The use of rigid-flex circuit boards can result in immense reduction in total PCB costs and expenditures.
4. Security: It provides secure connections for other components, providing stability and polarity. It also helps to reduce the number of connector components in an application.
