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Rigid Flex Circuits with BGA

Rigid Flex Circuits with BGA

Product number:JPS-119
Description

Rigid Flex Circuits with BGA

Material: FR-4(TG170)+Polyimide

No of layer: 4 Layer

Board thickness: 1.0mm

Copper thickness: 35um/1oz

Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um

Solder mask: Green

Other technology: BGA

Application: wearables, embedded, consumer electronics, drones, etc


 

 

Layer Stackup:

L1: Rigid FR-4

L2: Flex Polyimide

L3: Flex Polyimide

L4: Rigid FR-4


 

 

 

Rigid-Flex PCB Advantages:

1. Dynamism: Flexible circuits give you unlimited freedom of packaging geometry while retaining the precision density and repeatability of printed circuits.

 

2. Mechanical Stability: The interchanging layers of circuits form a strong foundation. The rigid boards provide stability, while flexible boards provide the flexibility required for installation in small spaces.

 

3. Space and Money Savings: The use of rigid-flex circuit boards can result in immense reduction in total PCB costs and expenditures.

 

4. Security: It provides secure connections for other components, providing stability and polarity. It also helps to reduce the number of connector components in an application.


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