Rigid Flex Circuits with BGA
Material: FR-4(TG170)+Polyimide
No of layer: 4 Layer
Board thickness: 1.0mm
Copper thickness: 35um/1oz
Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
Solder mask: Green
Other technology: BGA
Application: wearables, embedded, consumer electronics, drones, etc

Multi-layer Rigid Flex PCB
No of Layer: 4
Material: FR-4 (Shengyi)+ PI (Dupont)
Board thickness: 1.5mm
Copper weight: 35um
Surface finishing: ENIG=Immersion Gold
Application: Medical equipment, Robotics, Drones, Wearables, etc

4 Layer Rigid-Flex PCB
Material: FR-4(KB)+Polyimide(DuPont)
No of layer: 4 Layer
Board thickness: 1.6mm
Copper thickness: 35um/1oz
Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
Solder mask: Matt Black
Other technology: FR-4 Stiffner
Application: Digital Camera, Wearables, Embedded, Consumer Electronics, etc

2 Layer Rigid-Flex PCB

Board Description:
Rigid Part: FR-4, 1.6mm thickness+1oz copper
Flex PCB: Polyimide, 0.2mm thickness+1oz copper
Immersion Gold finishing
Application: medical, consumer electronics, embedded, aerospace, etc

Rigid-Flex PCB
Material: FR-4+PI
No of layer: 4 Layer
Board thickness: 1.6mm
Copper thickness: 35um/1oz
Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
Application: LCD, Camera, digital, wearables, embedded