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  • Rigid Flex Circuits with BGA
    Rigid Flex Circuits with BGA
    Material: FR-4(TG170)+Polyimide
    No of layer: 4 Layer
    Board thickness: 1.0mm
    Copper thickness: 35um/1oz
    Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
    Solder mask: Green
    Other technology: BGA
    Application: wearables, embedded, consumer electronics, drones, etc
  • Multi-layer Rigid Flex PCB
    Multi-layer Rigid Flex PCB
    No of Layer: 4
    Material: FR-4 (Shengyi)+ PI (Dupont)
    Board thickness: 1.5mm
    Copper weight: 35um
    Surface finishing: ENIG=Immersion Gold
    Application: Medical equipment, Robotics, Drones, Wearables, etc
  • 4 Layer Rigid-Flex PCB
    4 Layer Rigid-Flex PCB
    Material: FR-4(KB)+Polyimide(DuPont)
    No of layer: 4 Layer
    Board thickness: 1.6mm
    Copper thickness: 35um/1oz
    Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
    Solder mask: Matt Black
    Other technology: FR-4 Stiffner
    Application: Digital Camera, Wearables, Embedded, Consumer Electronics, etc
  • 2 Layer Rigid-Flex PCB
    2 Layer Rigid-Flex PCB

    Board Description:
    Rigid Part: FR-4, 1.6mm thickness+1oz copper
    Flex PCB: Polyimide, 0.2mm thickness+1oz copper
    Immersion Gold finishing
    Application: medical, consumer electronics, embedded, aerospace, etc
  • Rigid-Flex PCB
    Rigid-Flex PCB
    Material: FR-4+PI
    No of layer: 4 Layer
    Board thickness: 1.6mm
    Copper thickness: 35um/1oz
    Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
    Application: LCD, Camera, digital, wearables, embedded
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