No of Layer: 8
Material: FR-4, Shengyi, TG170
Board thickness: 1.6mm
Copper weight: 35um (1oz)
Surface Finishing: Immersion gold, Gold 0.05-0.1um, Nickle 3-5um
Special technonolgy: BGA, Impdance control, 3mil/3mil lines
Application: semi-conductors, FPGA, Embedded electronics, Medical, consumer electronics, etc

Material: Copper
Board thickness: 1.6mm
Copper thickness: 105um/3oz
Thermal conductivity: 2W
Surface treatment: ENIG
Solder mask: Taiyo super white
High heat resistance, high thermal conductivity
Application: LED, automotive,aerospace

Capability of 2L MCPCB
Base material: Aluminum/Copper/Iron Alloy
Thermal Conductivity (dielectrial layer): 1.5, 2.0, 3.0 W/m.K.
Board Thickness: 0.5mm~3.0mm
Copper thickness: 1.0 OZ, 2.0 OZ, 3.0 OZ
Soldermask: White/Black/Blue/Green/Red
Surface finishing: Immersion Gold, HASL, OSP

Material: FR-4, TG175
Thicknss: 1.6mm
Surface: ENIG finishing, Gold 0.05-0.1um, Nickel 3-5um
Solder mask: Green
Silk screen: White
Other requirement: Impedance control, BGA, Micro via
Application: Camera, HDMI, Embedded, FPGA, Digital, DSP, Sensing

Product description:
Blind vias, L1-L2, L7-L8
Buried vias, L2-L7
BGA work
line width/space: 3mil/3mil
ENIG finishing, 0.05-0.1um gold, 3-5um Nickel
APPLICATION: Medical, Aerospace, Telecommunications, Robotics

8 layer PCB
FR-4, TG170
1.8mm board thickness
1oz copper
ENIG, gold 0.05-0.1um, nickle 3-5um
green solder mask
single line impedance+differential impedance
BGA technology
3mil/3mil line space/width
Application: Medical equipment, industrial automation