• Impedance Control PCB
    No of Layer: 8
    Material: FR-4, Shengyi, TG170
    Board thickness: 1.6mm
    Copper weight: 35um (1oz)
    Surface Finishing: Immersion gold, Gold 0.05-0.1um, Nickle 3-5um
    Special technonolgy: BGA, Impdance control, 3mil/3mil lines
    Application: semi-conductors, FPGA, Embedded electronics, Medical, consumer electronics, etc
  • Copper-based PCB
    Material: Copper
    Board thickness: 1.6mm
    Copper thickness: 105um/3oz
    Thermal conductivity: 2W
    Surface treatment: ENIG
    Solder mask: Taiyo super white
    High heat resistance, high thermal conductivity
    Application: LED, automotive,aerospace
  • 2 Layer Aluminum PCB
    Capability of 2L MCPCB
    Base material: Aluminum/Copper/Iron Alloy
    Thermal Conductivity (dielectrial layer): 1.5, 2.0, 3.0 W/m.K.
    Board Thickness: 0.5mm~3.0mm
    Copper thickness: 1.0 OZ, 2.0 OZ, 3.0 OZ
    Soldermask: White/Black/Blue/Green/Red
    Surface finishing: Immersion Gold, HASL, OSP
    Material: FR-4, TG175
    Thicknss: 1.6mm
    Surface: ENIG finishing, Gold 0.05-0.1um, Nickel 3-5um
    Solder mask: Green
    Silk screen: White
    Other requirement: Impedance control, BGA, Micro via
    Application: Camera, HDMI, Embedded, FPGA, Digital, DSP, Sensing
  • Blind Buried Via PCB
    Product description:
    Blind vias, L1-L2, L7-L8
    Buried vias, L2-L7
    BGA work
    line width/space: 3mil/3mil
    ENIG finishing, 0.05-0.1um gold, 3-5um Nickel
    APPLICATION: Medical, Aerospace, Telecommunications, Robotics
  • 8 Layer HDI PCB
    8 layer PCB
    FR-4, TG170
    1.8mm board thickness
    1oz copper
    ENIG, gold 0.05-0.1um, nickle 3-5um
    green solder mask
    single line impedance+differential impedance
    BGA technology
    3mil/3mil line space/width
    Application: Medical equipment, industrial automation
Total 46 3 records Current page / Total 3 20 per page
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