6oz heavy copper PCB
No of Layer: 2
Material: FR-4, Kingboard, Shengyi
Board thickness: 2.50mm
Copper thickness: 6oz=210um
Surface treatment: ENIG, 0.05-0.1um gold+3-5um nickel
Key technology: 6oz thick copper
Application: Telecommunications, Industrial Control, Power Supply, UPS systems etc

9oz thick copper PCB
No of Layer: 2
Material: FR-4, Shengyi
Board thickness: 3.20mm
Copper thickness: 9oz=315um
Surface treatment: HASL lead free
Key technology: 3.2mm thick board, 9oz thick copper
Application: Telecommunications, Industrial Control, High Voltage Power Supply, etc

Hybrid multilayer PCB
No of Layer: 4
Material: FR-4, TG170 + Rogers RO4003C
Board thickness: 1.6mm
Copper weight: 35/18/18/35um
Surface finishing: Immersion gold
Solder mask color: green
Other requirement: impedance control, via-in-PAD
Application: Telecommunication, Satellite, RF, Aerospace, Medica, Antenna...

Flex PCB with Stiffeners
Material: Polyimide Kapton
Thickness: 0.13mm
Copper thickness: 1oz
Surface finishing: ENIG=Immersion gold
Orange coverlay+white silk screen
Other requirement: 2 Stiffeners( one FR-4 Stiffener+one Polyimide Stiffener)
Application: IoT, Wearables, consumer electronics, telecommunications, etc

Gold Fingers PCB

No of layer: 4 layer
Material: FR-4
Thickness: 1.6mm
Copper thickness: 35um copper/1oz
Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
Special technology: gold finger/Edge connector plating, gold thickness>=10''
Bevel edge: 30 degree
Application: Security, Industrial Electronics, CPU, Metherboard, Embedded

Flexible Printed Circuit Board
No of Layer: 2
Material: POLYIMIDE
Board thickness: 0.30mm
Copper thickness: 35um/1oz
Surface finishing: Immersion Gold
Yellow coverlay+white silk screen
Application: Medical equipment, Drones, Aorespace, Military, Consumer electronics

Aluminum PCB for LED lighting

Material: Aluminum substrate
Board thickness: 1.6mm
Copper thickness: 35um/1oz
Thermal conductivity: 4W
Brand: Denka Japan
Surface treatment: Immersion gold
Solder mask: Taiyo super white
High heat resistance, high thermal conductivity
Application: LED lighting, Automotive, Aerospace, etc

2 Layer Flex PCB
No of Layer: 2
Material: POLYIMIDE
Board thickness: 0.25mm
Copper thickness: 35um/1oz
Surface finishing: Immersion Gold
Yellow coverlay+white silk screen

Rigid Flex Circuits with BGA
Material: FR-4(TG170)+Polyimide
No of layer: 4 Layer
Board thickness: 1.0mm
Copper thickness: 35um/1oz
Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
Solder mask: Green
Other technology: BGA
Application: wearables, embedded, consumer electronics, drones, etc

Ceramic PCB
Material: ROGERS RO4350B, Ceramic Substrate
No of Layer: 1 layer
Board thickness: 1.0mm
Copper thickness: 2oz/70um
Surface finishing: HASL finishing
Solder mask: Taiyo white solder mask
Application: LED lighting, Military, Aerospace, Automotive, Medical, Optoelectronics, etc

Multi-layer Rigid Flex PCB
No of Layer: 4
Material: FR-4 (Shengyi)+ PI (Dupont)
Board thickness: 1.5mm
Copper weight: 35um
Surface finishing: ENIG=Immersion Gold
Application: Medical equipment, Robotics, Drones, Wearables, etc

Via In Pad PCB
No of Layer: 4, 6 or more
Material: FR-4, TG170, KB/Shengyi
Board thickness: 1.6mm
Copper weight: 35um=1oz
Surface finishing: ENIG=Immersion Gold
Solder mask: Glossy Blue
Silk screen: White
Key technology: Via In Pad

6 Layer impedance control PCB
No of Layer: 6
Material: FR-4, TG170
Board thickness: 1.7mm
Copper weight: 2/2/2/2/2/2 oz
Surface finishing: ENIG=Immersion Gold
Solder mask: Glossy Green
Other technology: BGA, Single-line impedance, Differtial-line impedance, via-in-PAD
Application: Industrial automation, Security system, Computer hardware, etc

4 Layer Rigid-Flex PCB
Material: FR-4(KB)+Polyimide(DuPont)
No of layer: 4 Layer
Board thickness: 1.6mm
Copper thickness: 35um/1oz
Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
Solder mask: Matt Black
Other technology: FR-4 Stiffner
Application: Digital Camera, Wearables, Embedded, Consumer Electronics, etc

4 Layer Castellated Hole PCB
No of Layer: 4 Layer
Material: FR-4, Shengyi
Board thickness: 1.6mm
Copper thickness: 1oz=35um
Surface finishing: ENIG, Gold 0.05-0.1um, Nickel 3-5um
Key Technology: Castellated Hole, Half Hole Plated
Application: consumer electronics, embedded, electronics, wireless, RFID

Castellated Hole PCB

No of Layer: 4 Layer
Material: FR-4, TG135
Board thickness: 1.6mm
Copper thickness: 2/1/1/2oz
Surface finishing: Immersion gold
Solder mask: White
Silk screen: Blue
Key Technology: Castellated Hole, Half Hole Plated
Application: Consumer electronics, Embedded, LED electronics, etc

8 Layer Blind-Buried-Via PCB

No of Layer: 8
Material: FR-4, TG170, Shengyi
Board thickness: 1.3mm
Copper thickness: 17um=0.5oz
Surface treatment: ENIG, Nickel 3-5um, Gold 0.05-0.1um
Key technology: BGA, Blind via, Buried via, Via-in-PAD, Micro-via, Impedance Control
Application: Telecommunications, Medical, Aerospace, Motherboard, Wireless

2 Layer Rigid-Flex PCB

Board Description:
Rigid Part: FR-4, 1.6mm thickness+1oz copper
Flex PCB: Polyimide, 0.2mm thickness+1oz copper
Immersion Gold finishing
Application: medical, consumer electronics, embedded, aerospace, etc

4 Layer PCB
Material: FR-4, TG170, Shengyi
Board thickness: 1.5mm
Copper thickness: 2/1/1/2 oz
Surface treatment: ENIG=Immersion Gold
Application: consumer electronics, embedded, security, power supply, wireless

Teflon PCB
material: Teflon polytetrafluoretheen (PTFE)
board thickness: 0.2mm
copper thickness: 70um
surface finishing: Immersion silver
No solder mask, no silk screen
application: medical, military, aerospace, machinery, metering