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  • Countersink Hole PCB
    A countersink is a conical hole cut into a manufactured object, or the cutter used to cut such a hole. A common use is to allow the head of a countersunk bolt or screw, when placed in the hole, to sit flush with or below the surface of the surrounding material.
  • Peelable Solder Mask PCB
    Peelable Solder Masks (also known as strippable mask or blue-mask) are applied by screen-printing, act as in-process protection and are removed either after processing at the PCB manufacturer or at the assembler.

    Peelable Solder Masks, provide such protection in soldering processes like wave soldering, reflow soldering or hot-air solder leveling (HASL). Reliable, time-saving and cost-saving in their application, they have long surpassed manual masking with heat-resistant tapes.
  • 1 Layer Ceramics PCB
    Ceramics PCB
    Material: Al2O3 Ceramic Substrate
    No of Layer: 1 layer
    Board thickness: 1.6mm
    Copper thickness: 1oz/35um
    Surface finishing: Immersion Gold/ENIG
    Solder mask: Taiyo white solder mask
    Thermal conductivity: 24W/m-K
    Dielectric constant: 10 +/-10%
    Breakdown Voltage: 17KV/mm
    Application: LED, Military, Aerospace, Automotive electronics
  • Edge connector PCB
    No of layer: 6 layer
    Material: FR-4, TG170
    Thickness: 1.6mm
    Copper thickness: 35um copper/1oz
    Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
    Special technology: gold finger/Edge connector plating, gold thickness 0.25-0.3um
    Bevel edge: 30 degree, 45 degree, 60 degree
    Application: Security, Industrial Electronics, CPU, DDS, HDD, Metherboard
  • 4 Layer Flex PCB
    4 LAYER FLEXIBLE PCB
    No of Layer: 4
    Material: Polyimide
    Board thickness: 0.2mm
    Copper thickness: 1oz
    Surface finishing: immersion gold
    Application: LCD, Antenna, Wearables, embedded electronics, LED, etc
  • 6 Layer PCB
    No of layer: 6 layers
    Material: FR-4 KB, ShengYi
    Board thickness: 1.5mm
    Copper thickness: 70um/20z
    Surface finishing: ENIG, gold 0.05-0.1um, nickel 3-6um
    Min line width: 0.1mm/4mil
    Min line space: 0.1mm/4mil
    Application: LED screen, medical equipment, Industrial automation, embedded
  • High TG170 PCB
    No of Layer: 2 Layer
    Material : FR-4, TG170 (Shengyi material)
    Board thickness: 0.8mm, 1.0mm, 1.6mm, 2.0mm
    Copper thickness: 1oz, 2oz, 3oz
    Surface: ENIG, Au 0.05um-0.1um, Ni 3-5um
    Application: Switches, Radio, Antenna, wireless, telecommunication, etc
  • Carbon Printing PCB
    At Jaapson PCB, we always use Atotech material: SD 2843.
    It has the below features and advantages:
    Excellent definition due to optimized Rheology
    Excellent adhesive strength and mechanical stability
    Resistant during HASL
    High chemical resistance
    Protecting during plating processes by peelable soldermask
  • Thick Copper PCB
    Material: FR-4
    Board thickness: 2.4mm
    Copper thickness: 140um/4oz
    Surface finishing: immersion gold,
    Solder mask: blue, green, yellow, white, red, black, purple
    Application: UPS, power supply, convertor, motor
  • 2W Thermal Copper Clad PCB
    Material: Copper laminate
    board thickness: 2.0mm
    copper thickness: 70um/2oz
    surface finishing: ENIG, Gold>0.05um, Nickle>3um
    Thermal conductivity: 2W
    Application: LED, automotive, aerospace
  • Rogers PCB
    Material: Rogers, RO4003C, RO4350B
    Board thickness: 0.5mm, 0.8mm, 1.5mm
    Copper thickness: 35um/1oz
    Surface finishing: immersion gold, gold 0.05-0.1um, nickel 3-5um
    Solder mask: Taiyo super white
    Application: military, aerospace, telecommunication
  • 3mm Aluminum PCB
    Material: Aluminum, 5052
    Board thickness: 3.0mm
    Copper thickness: 105UM/3oz
    Thermal conductivity: 1.5W, 2W
    Break down voltage [AC KV]: 5
    Dielectric constant: 4.5-5.0
    Surface treatment: HASL lead free
    Solder mask: green solder mask
  • 4 Layer Gold Finger PCB
    No of layer: 4 layer
    Material: FR-4, TG135
    Thickness: 1.6mm
    Copper thickness: 35um copper/1oz
    Surface finishing: Immersion gold
    Special technology: gold finger, gold thickness>10’’
    Application: Game cards, security, industrial electronics
  • Rigid-Flex PCB
    Rigid-Flex PCB
    Material: FR-4+PI
    No of layer: 4 Layer
    Board thickness: 1.6mm
    Copper thickness: 35um/1oz
    Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um
    Application: LCD, Camera, digital, wearables, embedded
  • Impedance Control PCB
    No of Layer: 8
    Material: FR-4, Shengyi, TG170
    Board thickness: 1.6mm
    Copper weight: 35um (1oz)
    Surface Finishing: Immersion gold, Gold 0.05-0.1um, Nickle 3-5um
    Special technonolgy: BGA, Impdance control, 3mil/3mil lines
    Application: semi-conductors, FPGA, Embedded electronics, Medical, consumer electronics, etc
  • Copper-based PCB
    Material: Copper
    Board thickness: 1.6mm
    Copper thickness: 105um/3oz
    Thermal conductivity: 2W
    Surface treatment: ENIG
    Solder mask: Taiyo super white
    High heat resistance, high thermal conductivity
    Application: LED, automotive,aerospace
  • 2 Layer Aluminum PCB
    Capability of 2L MCPCB
    Base material: Aluminum/Copper/Iron Alloy
    Thermal Conductivity (dielectrial layer): 1.5, 2.0, 3.0 W/m.K.
    Board Thickness: 0.5mm~3.0mm
    Copper thickness: 1.0 OZ, 2.0 OZ, 3.0 OZ
    Soldermask: White/Black/Blue/Green/Red
    Surface finishing: Immersion Gold, HASL, OSP
  • 10-LAYER-HDI-PCB
    Material: FR-4, TG175
    Thicknss: 1.6mm
    Surface: ENIG finishing, Gold 0.05-0.1um, Nickel 3-5um
    Solder mask: Green
    Silk screen: White
    Other requirement: Impedance control, BGA, Micro via
    Application: Camera, HDMI, Embedded, FPGA, Digital, DSP, Sensing
  • Blind Buried Via PCB
    Product description:
    Blind vias, L1-L2, L7-L8
    Buried vias, L2-L7
    BGA work
    line width/space: 3mil/3mil
    ENIG finishing, 0.05-0.1um gold, 3-5um Nickel
    APPLICATION: Medical, Aerospace, Telecommunications, Robotics
  • 8 Layer HDI PCB
    8 layer PCB
    FR-4, TG170
    1.8mm board thickness
    1oz copper
    ENIG, gold 0.05-0.1um, nickle 3-5um
    green solder mask
    single line impedance+differential impedance
    BGA technology
    3mil/3mil line space/width
    Application: Medical equipment, industrial automation
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Contact Us
TEL: 86-755-82596922
EMAIL: info@jaapson-pcb.com
FAX: 86-755-82596922 or 82596923
SKYPE: jaapsoncircuits
Jaapson, Expert in HDI multi-layer PCB manufacturing
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